Michael Dang

Date of Award

2025

First Advisor

David Myers

Second Advisor

Sami Alshalwi

Abstract

This thesis undertakes a comprehensive investigation into the technological, economic, and strategic dimensions of three-dimensional integrated circuits, a rapidly emerging paradigm in semiconductor design and manufacturing. The project scope encompasses both foundational and applied aspects of 3D integration, aiming to provide an integrated understanding of how vertical chip stacking is reshaping modern electronics. Technically, the project explores the underlying principles and processes enabling 3D ICs, including through-silicon vias (TSVs), wafer bonding methods, monolithic 3D integration, and thermal management techniques. Emphasis is placed on understanding the practical engineering challenges—such as alignment precision, heat dissipation, and yield degradation—and how modern fabrication and packaging solutions are addressing these issues. The project also evaluates key 3D IC architectures, comparing fine-grained and coarse-grained partitioning strategies, and investigates design approaches that optimize vertical interconnect density, performance-per-watt, and heterogeneous integration. These analyses span both academic prototypes and commercial implementations, establishing a bridge between research frontiers and industrial practice. Economically, the thesis evaluates the cost-benefit trade-offs of adopting 3D ICs, focusing on yield implications, manufacturing complexity, chiplet-based economies, and the performance gains that justify higher integration costs. The business case for 3D IC adoption is examined through real-world examples in GPUs, smartphones, FPGAs, and AI accelerators. Strategically, the scope includes a geopolitical and policy-oriented analysis, focusing on how countries and corporations are investing in 3D IC technologies to secure semiconductor leadership. Special attention is given to government programs like the U.S. CHIPS Act and China’s packaging initiatives, highlighting how 3D IC capabilities are becoming pivotal in national security and economic competitiveness. Finally, this thesis surveys the broader industry ecosystem supporting 3D IC development—such as venture-backed startups, standards organizations like UCIe and IEEE, and collaborative R&D programs—to show how technical innovation is being matched with ecosystem maturity. The aim is to deliver a multidimensional perspective that informs not only technical research but also strategic planning, investment decisions, and policy formulation related to the future of semiconductors.

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